Yield and timing constrained spare TSV assignment for three-dimensional integrated circuits

Yu Guang Chen, Kuan Yu Lai, Ming Chao Lee, Yiyu Shi, Wing Kai Hon, Shih Chieh Chang

研究成果: 書貢獻/報告類型會議論文篇章同行評審

3 引文 斯高帕斯(Scopus)

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Engineering & Materials Science