Wear and corrosion behaviors of SiCp reinforced copper matrix composite formed by hot pressing

研究成果: 雜誌貢獻期刊論文同行評審

12 引文 斯高帕斯(Scopus)

摘要

Wear and corrosion behaviors of SiCp reinforced copper matrix composite formed by hot pressing were studied. The results show that the tensile strength, hardness and material porosity increased with the increase of SiCp content. The wear rate of Cu/SiCp composites decreased with the increase of SiCp content, applied load and high sliding velocity (exceeds 300 rpm). In contrast the wear rate of Cu/SiCp composites increased with low sliding velocity (100 rpm to 300 rpm). A dramatic wear rate of Cu/SiCp composite is observed at the initial wear stage (0-400 m). However, when sliding distance exceeds 800 m, the wear behavior becomes more stable. In addition, the corrosion resistance of Cu/SiCp composite in 5% NaCl solution increases with increasing pH value, but decreases with increasing SiCp content. Pits always initiate at the interfacial boundary between SiCp and copper, which makes SiCp particles peeling and copper matrix pitting deeply.

原文???core.languages.en_GB???
頁(從 - 到)9-16
頁數8
期刊Scandinavian Journal of Metallurgy
28
發行號1
出版狀態已出版 - 2月 1999

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