Wafer-Scale Bi-Assisted Semi-Auto Dry Transfer and Fabrication of High-Performance Monolayer CVD WS2Transistor

Ming Yang Li, Ching Hao Hsu, Shin Wei Shen, Ang Sheng Chou, Yuxuan Cosmi Lin, Chih Piao Chuu, Ning Yang, Sui An Chou, Lin Yun Huang, Chao Ching Cheng, Wei Yen Woon, Szuya Liao, Chih I. Wu, Lain Jong Li, Iuliana Radu, H. S.Philip Wong, Han Wang

研究成果: 書貢獻/報告類型會議論文篇章同行評審

12 引文 斯高帕斯(Scopus)

摘要

A novel wafer-scale semi-automated dry transfer process for monolayer (1L) CVD WS2 was developed utilizing the weakly coupled interface between semimetal (Bi) and two-dimensional (2D) semiconductor (WS2). Bi semimetal serves as a gently adhesive transfer template for 2D materials, introducing minimal additional defects during the transfer process. Based on 2D materials processed using this new transfer method, semimetal-contacted (Bi and Sb) monolayer CVD WS2 nFETs were further demonstrated at wafer scale. Our CVD 1L WS2 nFETs fabricated using semimetal-assisted transfer with semimetal (Bi and Sb) contacts show record high on-current of 250 A/m and 243 A/m at VDS = 1 V, and record low contact resistance of 0.63 kOm and 0.73 kOm, respectively.

原文???core.languages.en_GB???
主出版物標題2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022
發行者Institute of Electrical and Electronics Engineers Inc.
頁面290-291
頁數2
ISBN(電子)9781665497725
DOIs
出版狀態已出版 - 2022
事件2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022 - Honolulu, United States
持續時間: 12 6月 202217 6月 2022

出版系列

名字Digest of Technical Papers - Symposium on VLSI Technology
2022-June
ISSN(列印)0743-1562

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???event.eventtypes.event.conference???2022 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2022
國家/地區United States
城市Honolulu
期間12/06/2217/06/22

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