@inproceedings{ed6bd8597f614e5cb4087de635a69f73,
title = "Wafer positioning by laser scanning method",
abstract = "A laser scanning method for wafer positioning is proposed. This wafer positioning method incorporates a laser scanner system and a scattering light receiving system. The scanner is used to reflect a laser beam into a scanning line on the sensing area. As the wafer passes by the scanning line, a scattering light receiving system detects the time-sequence signal of the scattered lights. The position of wafer relative to the robot plate is determined by signal processing of the time-sequence signal. The measurement precision is about 0.3 mm.",
keywords = "Laser scanning, Wafer positioning",
author = "Lee, {Ju Yi} and Chen, {Yi Cheng} and Chen, {Jian You} and Lee, {Yun Yan} and Chen, {Yu Bin}",
year = "2011",
language = "???core.languages.en_GB???",
isbn = "9784907764395",
series = "Proceedings of the SICE Annual Conference",
publisher = "Society of Instrument and Control Engineers (SICE)",
pages = "1833--1837",
booktitle = "SICE 2011 - SICE Annual Conference 2011, Final Program and Abstracts",
note = "50th Annual Conference on Society of Instrument and Control Engineers, SICE 2011 ; Conference date: 13-09-2011 Through 18-09-2011",
}