摘要
A high performance VLSI architecture is proposed for the 3D sound generation chip. A single 3D sound chip design reduces the cost and size of many audio systems. The proposed 3D sound VLSI architecture has the following merits: excellent accuracy results due to the accuracy studies for the finite word length; high speed operations owing to the high performance concurrent processing structure; and real-time response for 44.1 KHz sampling data.
原文 | ???core.languages.en_GB??? |
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頁(從 - 到) | 296-297 |
頁數 | 2 |
期刊 | Digest of Technical Papers - IEEE International Conference on Consumer Electronics |
出版狀態 | 已出版 - 1997 |
事件 | Proceedings of the 1997 16th International Conference on Consumer Electronics, ICCE - Rosemont, IL, USA 持續時間: 11 6月 1997 → 13 6月 1997 |