Use of 3,3-thiobis(1-propanesulfonate) to accelerate microvia filling by copper electroplating

Po Fana Chan, Yong Da Chiu, Wei Ping Dow, Klaus Krug, Yuh Lang Lee, Shueh Lin Yauc

研究成果: 雜誌貢獻期刊論文同行評審

9 引文 斯高帕斯(Scopus)

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Engineering & Materials Science

Chemical Compounds