Use of 3,3-thiobis(1-propanesulfonate) to accelerate microvia filling by copper electroplating

Po Fana Chan, Yong Da Chiu, Wei Ping Dow, Klaus Krug, Yuh Lang Lee, Shueh Lin Yauc

研究成果: 雜誌貢獻期刊論文同行評審

9 引文 斯高帕斯(Scopus)

摘要

The most widely used accelerators for microvia filling by copper electroplating are 3-mercapto-1-propanesulfonate (MPS) and bis(3-sulfopropyl) disulfide (SPS). In this study, a new accelerator, 3,3-thiobis(1- propanesulfonate) (TBPS), which has neither a thiol group (e.g., MPS) nor a disulfide group (e.g., SPS) but rather contains a thioether group and two sulfonic acid groups, was investigated and formulated to perform microvia filling by copper electroplating. The accelerating effect of TBPS on copper electrodeposition and its chemical interaction with chloride ions and H2SO4 were characterized by galvanostatic measurements. Electrochemical analyzes showed that the acceleration of TBPS on copper electrodeposition strongly depended on the chloride ion and H2SO4 concentrations. An optimal copper plating solution composed of CuSO4, polyethylene glycol (PEG), TBPS, chloride ions, and H2SO4 was developed and used to perform bottom-up copper filling of microvias. Although TBPS contains a thioether group inste of a thiol group, a trace amount of TBPS can strongly accelerate copper electrodeposition in the presence of proper chloride ion and H2SO4 concentrations.

原文???core.languages.en_GB???
頁(從 - 到)D3271-D3277
期刊Journal of the Electrochemical Society
160
發行號12
DOIs
出版狀態已出版 - 2013

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