Two-way coupled MBD–DEM modeling and experimental validation for the dynamic response of mechanisms containing damping particles

Yu Ren Wu, Yun Chi Chung, I. Cheng Wang

研究成果: 雜誌貢獻 › 期刊論文 › 同行評審

25 引文 斯高帕斯（Scopus）

指紋

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Engineering

Keyphrases

Material Science