Thermal modeling and performance of LED packaging for illuminating device

Keyphrases

• LED Packaging 100%
• Dielectric Layer 100%
• Thermal Performance 100%
• Thermal Modeling 100%
• External Thermal Resistance 100%
• Convective Boundary 100%
• Internal Thermal Resistance 100%
• Convective Effects 50%
• Three-dimensional (3D) 50%
• Thermal Conductivity 50%
• Finite Element Method 50%
• Heat Sink 50%
• Heat Dissipating 50%
• Heat Effect 50%
• LED Module 50%
• Thermal Model 50%
• Lateral Surface 50%
• LED Die 50%
• Die-bonding 50%
• Natural Convective 50%
• Heat Fins 50%

Engineering

• Heat Resistance 100%
• Convective 66%
• Dielectric Layer 66%
• Convective Effect 33%
• Bottom Surface 33%
• Thermal Conductivity 33%
• Thermal Model 33%
• Real Effect 33%
• Lateral Surface 33%
• Finite Element Analysis 33%

Material Science

• Light-Emitting Diode 100%
• Heat Resistance 50%
• Dielectric Material 33%
• Thermal Conductivity 16%
• Finite Element Method 16%
• Surface (Surface Science) 16%