Thermal management: Component to systems level

Te Yuan Chung

doi:10.1007/978-3-319-00176-0_60

Thermal management: Component to systems level

Te Yuan Chung

光電科學與工程學系

研究成果: 書貢獻/報告類型 › 篇章 › 同行評審

1 引文斯高帕斯（Scopus）

摘要

Thermal management is one of the most essential issues for LED applications. The output power, efficiency, emission spectrum and reliability of the LED chip and phosphor are functions of temperature. Without proper thermal management, the output of the LED could depart from the desired performance. Basic heat transfer phenomena and corresponding calculations are introduced as well as the thermal behaviors and concerns of the essential components of an LED. A quick method to estimate the thermal resistance of an LED package is provided based on the shape factor of the geometry at the end of this chapter.

原文	???core.languages.en_GB???
主出版物標題	Handbook of Advanced Lighting Technology
發行者	Springer International Publishing
頁面	239-267
頁數	29
ISBN（電子）	9783319001760
ISBN（列印）	9783319001753
DOIs	https://doi.org/10.1007/978-3-319-00176-0_60
出版狀態	已出版 - 1 1月 2017

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10.1007/978-3-319-00176-0_60

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Thermal management: Component to systems level

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