Thermal aging effect on the joint strength between an SOFC glass-ceramic sealant and LSM-coated metallic interconnect

Fan Lin Hou, Chih Kuang Lin, Atsushi Sugeta, Hiroyuki Akebono, Szu Han Wu, Peng Yang, Ruey Yi Lee

研究成果: 書貢獻/報告類型會議論文篇章同行評審

1 引文 斯高帕斯(Scopus)

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Engineering & Materials Science