The study of machine learning for wire rupture prediction in WEDM

Ping Hsien Chou, Yean Ren Hwang, Bling Hwa Yan

研究成果: 雜誌貢獻期刊論文同行評審

3 引文 斯高帕斯(Scopus)


During wire electrical discharge machining (WEDM), wire rupture may deteriorate workpieces’ machined surfaces and increase the processing time. However, only a few referenced papers focused on wire rupture during past decades because of its complexity. In this research, machine learning (ML) technique was applied to analyze the relationship between manufacturing parameters and the chance of wire rupture. Three parameters, including gap voltage (GV), feed rate (FR), and water resistance (WR), were considered as training features, and a total of 298 sets were used to train an artificial neural network (ANN). The results show that the prediction accuracy of wire rupture for 10 s in advance is above 85%. This research developed a new method to apply the real-time predict wire rupture and is faster, more accurate than prior research. Besides, this method is extendable for future measured data when the usable sensor data are increasing.

頁(從 - 到)1301-1311
期刊International Journal of Advanced Manufacturing Technology
出版狀態已出版 - 3月 2022


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