The heat dissipation performance of LED applied a MHP

Gwo Jiun Sheu, Farn Shiun Hwu, Shen Hang Tu, Wen Tung Chen, Jenq Yang Chang, Jyh Chen Chen

研究成果: 雜誌貢獻會議論文同行評審

21 引文 斯高帕斯(Scopus)


This study will discuss the heat dissipation effect of light emitting diode (LED) device applied a commercial miniature heat pipe (MHP). For lowering the thermal resistance of LED, the MHP can reduce the working temperature and raise the allowable input power of LED chip obviously. By comparing with a copper rod, the LED temperature was decreased about 19% at 1.59W input power and the LED power was increased about 43% under 118°C chip temperature. On the other hand, the thermal resistance of LED also can be reduced by using a thinner slug. Moreover, the results showed that the thermal spreading effect was significant. The MHP could be used to avoid the hot spot of LED packaging due to its excellent heat spreading property. Simultaneously, a LED thermal simulation was carried out to verify the optimum value of slug thickness.

頁(從 - 到)1-8
期刊Proceedings of SPIE - The International Society for Optical Engineering
出版狀態已出版 - 2005
事件Fifth International Conference on Solid State Lighting - San Diego, CA, United States
持續時間: 1 8月 20054 8月 2005


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