摘要
The fatigue behaviors of 7075-T73 alloy with/without anodization/sealing treatment were investigated in this study. The microstructure of different samples was analyzed by electron microscopy. As the experiments, the microstructure were observed from the anodized/sealed samples to indicate that precipitates trapped at subsurface near film/metal (f/m) interface would partly dissolved and the deformed matrix existed high fractions of high angle grain boundaries. The bare 7075-T73 alloy samples achieved fatigue strength of 225 MPa and the anodized/sealed samples enhanced their fatigue strength at 107 life cycles with 1020μm film thickness. The fractured anodized/sealed sample showed fine striation spacing than bare sample after subjected to low stress amplitude.
| 原文 | ???core.languages.en_GB??? |
|---|---|
| 頁（從 - 到） | 1280-1285 |
| 頁數 | 6 |
| 期刊 | Materials Transactions |
| 卷 | 55 |
| 發行號 | 8 |
| DOIs | |
| 出版狀態 | 已出版 - 2014 |