The Decision Mechanism Uses the Multiple-Tests Scheme to Improve Test Yield in IC Testing

Chung Huang Yeh, Jwu E. Chen

研究成果: 書貢獻/報告類型會議論文篇章同行評審

8 引文 斯高帕斯(Scopus)

摘要

This study aims to exploit an integrated-circuit (IC) testing model based on a statistical simulation method to evaluate the test yield and quality of IC products. Using normal probability distributions of product properties, we digitally analyzed IC yield and quality, introduced testing threshold and guardband, and assessed various parameters' influence on outcomes. Because future manufacturing speed is unpredictable, we used current manufacturing technology and existing-product electrical properties to estimate future product-distribution trends. Since the progress of developmental improvements for testing technologies has been slow, it has become a greater challenge for a supplier to determine the use of existing instruments and tools to achieve quality products with near-zero defects. To improve product quality, a new scheme of Multiple tests has been proposed. Moreover, we used a set of parameters from the International Technology Roadmap for Semiconductors (ITRS) to demonstrate the proposed Multiple testing, and to show that the test yield can be improved while attaining the desired quality.

原文???core.languages.en_GB???
主出版物標題Proceedings - 2020 IEEE International Test Conference in Asia, ITC-Asia 2020
發行者Institute of Electrical and Electronics Engineers Inc.
頁面88-93
頁數6
ISBN(電子)9781728189444
DOIs
出版狀態已出版 - 9月 2020
事件4th IEEE International Test Conference in Asia, ITC-Asia 2020 - Taipei, Taiwan
持續時間: 23 9月 202025 9月 2020

出版系列

名字Proceedings - 2020 IEEE International Test Conference in Asia, ITC-Asia 2020

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???event.eventtypes.event.conference???4th IEEE International Test Conference in Asia, ITC-Asia 2020
國家/地區Taiwan
城市Taipei
期間23/09/2025/09/20

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