@inproceedings{23817e7dc4bc47309bad993be86cce83,
title = "The composition of intermetallic compounds in Sn-Ag-Bi-In solders on Cu substrates",
abstract = "84Sn-3Ag-3Bi-10In and 89Sn-3Ag-3Bi-5In solders were subjected to reflow and solid state aging. The intermetallic compounds that formed at the interfaces between the solders and the Cu substrates and those that formed in the bulk solders in both test conditions were investigated. In the as-reflow samples, the intermetallic compounds were identified as Cu3Sn and Cu 6Sn5. After solid state aging, these compounds became Cu6(Sn,In)5 and Cu3(Sn,In). The compounds that formed in the bulk solders were ζ phase, the solid solution of Ag 3Sn and Ag2In.",
author = "Chen, {M. H.} and Jieng, {Y. Y.} and Wu, {Albert T.}",
year = "2008",
doi = "10.1109/IMPACT.2008.4783846",
language = "???core.languages.en_GB???",
isbn = "9781424436248",
series = "2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008",
pages = "209--211",
booktitle = "2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008",
note = "2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008 ; Conference date: 22-10-2008 Through 24-10-2008",
}