TY - JOUR
T1 - System-on-a-Package (SOP) module development for a digital, RF and optical mixed signal integrated system
AU - Lim, K.
AU - Wan, L.
AU - Guidotti, D.
AU - Sundaram, V.
AU - White, G.
AU - Liu, F.
AU - Bhattacharya, S.
AU - Doraiswami, R.
AU - Chang, Y. J.
AU - Yu, J.
AU - Sarkar, S.
AU - Pratap, R.
AU - Yoon, S. W.
AU - Maeng, M.
AU - Pinel, S.
AU - Laskar, J.
AU - Tentzeris, M.
AU - Chang, G. K.
AU - Swaminathan, M.
AU - Tummala, R.
PY - 2004
Y1 - 2004
N2 - One highly integrated mixed-signal testbed has been developed to demonstrate the concept and realization of advanced System-on-a-Package concept. This experimental system, called Intelligent Network Communicator (INC), deals with three different status of the signals, digital, RF and optical, in a single packaging platform. The INC transmits and receives the high-speed digital signal and wireless signal over the embedded optical waveguide channel. After three years of development efforts, the system has been fabricated by utilizing advanced packaging and assembly processes and full functionality has been demonstrated successfully. Before the final test, each of the sub-blocks has been separately developed and tested. The test results clearly show that the developed system performance meets the design goals. The digital block generated up to 3.2 Gbps of data stream, the RF block had less than -1.SdB of insertion loss up to 6 GHz and the optical block achieved 10Gbps throughput over the embedded optical waveguide built on the low-cost organic substrate.
AB - One highly integrated mixed-signal testbed has been developed to demonstrate the concept and realization of advanced System-on-a-Package concept. This experimental system, called Intelligent Network Communicator (INC), deals with three different status of the signals, digital, RF and optical, in a single packaging platform. The INC transmits and receives the high-speed digital signal and wireless signal over the embedded optical waveguide channel. After three years of development efforts, the system has been fabricated by utilizing advanced packaging and assembly processes and full functionality has been demonstrated successfully. Before the final test, each of the sub-blocks has been separately developed and tested. The test results clearly show that the developed system performance meets the design goals. The digital block generated up to 3.2 Gbps of data stream, the RF block had less than -1.SdB of insertion loss up to 6 GHz and the optical block achieved 10Gbps throughput over the embedded optical waveguide built on the low-cost organic substrate.
UR - http://www.scopus.com/inward/record.url?scp=10444236437&partnerID=8YFLogxK
M3 - 會議論文
AN - SCOPUS:10444236437
SN - 0569-5503
VL - 2
SP - 1693
EP - 1697
JO - Proceedings - Electronic Components and Technology Conference
JF - Proceedings - Electronic Components and Technology Conference
T2 - 2004 Proceedings - 54th Electronic Components and Technology Conference
Y2 - 1 June 2004 through 4 June 2004
ER -