Surface roughening of silicon wafer solar cell by using ecdm method

Hai Ping Tsui, Kuang Hua Chang, Biing Hwa Yan

研究成果: 書貢獻/報告類型會議論文篇章同行評審

摘要

This research proposes surface roughening of silicon wafer solar cell by electrochemical discharge machining (ECDM). The stainless steel was used as negative electrode. The graphite was used as the positive electrode acting as the auxiliary electrode. The potassium hydroxide was used as the electrolyte. The processing parameters include the machining voltage, the processing time, the machining gap, the electrolyte concentration, the additive agent concentration, pulse frequency and duty factor, etc. The result of experiments reveals that appropriate concentrations of ethanol can expand the size of the pores and enhance surface roughening effect. The appropriate processing parameters are a machining gap of 200μm, voltage of 48V, concentration of potassium hydroxide of 3M, concentration of ethanol of 4%. The electrochemical discharge machined surface roughness was increased from 0.417μm to 0.915μm using one minute processing time. The average reflectance rate of the textured surface was decreased from 29.6% to 12.7%. This study reveals that ECDM method has the advantage of short processing time and can generate a higher surface roughness and the porous structure.

原文???core.languages.en_GB???
主出版物標題Recent Development in Machining, Materials and Mechanical Technologies III
編輯Huy Bich Nguyen
發行者Trans Tech Publications Ltd
頁面62-70
頁數9
ISBN(列印)9783035714821
DOIs
出版狀態已出版 - 2019
事件International Conference on Machining, Materials and Mechanical Technologies, IC3MT 2018 - Ho Chi Minh City, Viet Nam
持續時間: 19 9月 201822 9月 2018

出版系列

名字Key Engineering Materials
825 KEM
ISSN(列印)1013-9826
ISSN(電子)1662-9795

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???event.eventtypes.event.conference???International Conference on Machining, Materials and Mechanical Technologies, IC3MT 2018
國家/地區Viet Nam
城市Ho Chi Minh City
期間19/09/1822/09/18

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