Super compact and ultrabroadband power divider using silicon-based integrated passive device technology

Xuan Hong Liu, Yo Shen Lin

研究成果: 雜誌貢獻期刊論文同行評審

19 引文 斯高帕斯(Scopus)

摘要

In this paper, an ultrabroadband two-way power divider with super compact circuit size is demonstrated using the silicon-based integrated passive device technology. By replacing all the eight quarter-wavelength lines in a conventional four-section Wilkinson power divider with bridged-T coils, the circuit size can be largely reduced without reducing the bandwidth. As a result, an ultrabroadband power divider with 10-dB return loss/isolation bandwidth from 1.85 to 21.30 GHz can be realized in a very compact circuit size of 3.41 × 1.17 mm2, which is only about 0.132λ 0× 0.045λ 0 at the center frequency f0 = 11.6 GHz. The measured insertion loss is less than 2 dB in the same frequency range. To the best of our knowledge, this is the smallest ultrabroadband passive power divider design with larger than 10:1 bandwidth ever reported.

原文???core.languages.en_GB???
文章編號7736136
頁(從 - 到)1855-1864
頁數10
期刊IEEE Transactions on Components, Packaging and Manufacturing Technology
6
發行號12
DOIs
出版狀態已出版 - 12月 2016

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