@inproceedings{a6ec1a3f2d8347cda96fd405f29fd376,
title = "Study on the inherently safer design strategy of semiconductor process and the improvement of facility safety management efficiency",
abstract = "This study uses chemical substances and products for wet etching and dry etching. In the table the etching process hazard analysis is also performed and aimed at the new project of the change system, and completed HAZOP analysis for raw of material changes and establish improvement measures. After the risk control measures established by the institute, it was found that unsafe behaviors effectively improved the focus of the {"}gas cylinder replacement operation{"} in 2017 was reduced from 24 to 8 pieces.",
keywords = "10nm process, Etching process and facility system, Inherently safer design, Risk assessment",
author = "Chen, {Vivien Yi Chun} and Chu, {Kai Chun} and Chang, {Kuo Chi} and Horng, {Der Juinn} and Lin, {Jerry Chao Lee}",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 ; Conference date: 24-10-2018 Through 26-10-2018",
year = "2018",
month = jul,
day = "2",
doi = "10.1109/IMPACT.2018.8625816",
language = "???core.languages.en_GB???",
series = "Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT",
publisher = "IEEE Computer Society",
pages = "222--225",
booktitle = "13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018",
}