@inproceedings{596fe25aa50d4c7e9fa5dadfab5aed23,
title = "Study of wafer cleaning process safety using Inherently Safer Design Strategies",
abstract = "The wafer process disasters is to use inherently safer design (ISD) strategies to take full account of the manufacturing plant is built to eliminate hazards of energy source; disasters and accidents must be greatly reduced. This study used concept of substituted wet bench chemicals from N-396 to replace to DSP. The experimental results due to the 11 batches and replaced of 10nm wafer process, the product yield increased to 85.36\% from 83.75\%, improvement of electrical characteristics DC (\%) from 6.37\% to 6.44, improvement of frequency response (\%) from 5.27\% down to 4.30\%, improvement of stripping ability (\%) from 4.47\% to 4.20\%.",
keywords = "Etching process, High-tech process, Inherently safer design, Substitution, Wafer cleaning process",
author = "Chang, \{Kuo Chi\} and Chu, \{Kai Chun\} and Horng, \{Der Juinn\} and Lin, \{Jerry Chao Lee\} and Chen, \{Vivien Yi Chun\}",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 ; Conference date: 24-10-2018 Through 26-10-2018",
year = "2018",
month = jul,
day = "2",
doi = "10.1109/IMPACT.2018.8625796",
language = "???core.languages.en\_GB???",
series = "Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT",
publisher = "IEEE Computer Society",
pages = "218--221",
booktitle = "13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018",
}