Study of wafer cleaning process safety using Inherently Safer Design Strategies

Kuo Chi Chang, Kai Chun Chu, Der Juinn Horng, Jerry Chao Lee Lin, Vivien Yi Chun Chen

研究成果: 書貢獻/報告類型會議論文篇章同行評審

5 引文 斯高帕斯(Scopus)

摘要

The wafer process disasters is to use inherently safer design (ISD) strategies to take full account of the manufacturing plant is built to eliminate hazards of energy source; disasters and accidents must be greatly reduced. This study used concept of substituted wet bench chemicals from N-396 to replace to DSP. The experimental results due to the 11 batches and replaced of 10nm wafer process, the product yield increased to 85.36% from 83.75%, improvement of electrical characteristics DC (%) from 6.37% to 6.44, improvement of frequency response (%) from 5.27% down to 4.30%, improvement of stripping ability (%) from 4.47% to 4.20%.

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主出版物標題13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
發行者IEEE Computer Society
頁面218-221
頁數4
ISBN(電子)9781538656150
DOIs
出版狀態已出版 - 2 7月 2018
事件13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018 - Taipei, Taiwan
持續時間: 24 10月 201826 10月 2018

出版系列

名字Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
2018-October
ISSN(列印)2150-5934
ISSN(電子)2150-5942

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???event.eventtypes.event.conference???13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018
國家/地區Taiwan
城市Taipei
期間24/10/1826/10/18

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