Study of the strengthening mechanism of electrodeposited Ni-B thin films with ultra-low boron content

Hung Hua Sheu, Yu Chih Tzeng, Jian Huang Syu

研究成果: 雜誌貢獻期刊論文同行評審

16 引文 斯高帕斯(Scopus)

摘要

In this study, the hardening behavior of Ni-B thin films with ultra-low boron contents is investigated by synchrotron X-ray diffraction and high resolution transmission electron microscope (HR-TEM). The hardness of Ni-B thin films increases with an increase of boron content within films, the highest hardness is approximately at 1120 Hv. average grain size about 4.64 nm. The analysis of synchrotron X-ray diffraction and HR-TEM indicated the strengthening mechanism of Ni-B thin films can be attributed to a combined effect of solid solution strengthening and fine grain strengthening mechanisms.

原文???core.languages.en_GB???
頁(從 - 到)275-277
頁數3
期刊Materials Letters
238
DOIs
出版狀態已出版 - 1 3月 2019

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