Study of interaction between Cu-Sn and Ni-Sn interfacial reactions by Ni-Sn3.5Ag-Cu sandwich structure

S. J. Wang, C. Y. Liu

研究成果: 雜誌貢獻 › 期刊論文 › 同行評審

136 引文 斯高帕斯（Scopus）

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Keyphrases

Engineering

Biochemistry, Genetics and Molecular Biology

Material Science