每年專案
摘要
This paper investigates the interfacial reaction between Sn and Sn3Ag0.5Cu (SAC305) solder on n-type Bi2Te3 thermoelectric material. An electroless Ni-P layer successfully suppressed the formation of porous SnTe intermetallic compound at the interface. The formation of the layers between Bi2Te3 and Ni-P indicates that Te is the dominant diffusing species. Shear tests were conducted on both Sn and SAC305 solder on n- and p-type Bi2Te3 with and without a Ni-P barrier layer. Without a Ni-P layer, porous SnTe would result in a more brittle fracture. A comparison of joint strength for n- and p-type thermoelectric modules is evaluated by the shear test. Adding a diffusion barrier increases the mechanical strength by 19.4% in n-type and 74.0% in p-type thermoelectric modules.
原文 | ???core.languages.en_GB??? |
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頁(從 - 到) | 148-154 |
頁數 | 7 |
期刊 | Journal of Electronic Materials |
卷 | 47 |
發行號 | 1 |
DOIs | |
出版狀態 | 已出版 - 1 1月 2018 |
指紋
深入研究「Study of Diffusion Barrier for Solder/n-Type Bi2Te3 and Bonding Strength for p- and n-Type Thermoelectric Modules」主題。共同形成了獨特的指紋。專案
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