Studies on reducing leakage current of large-area silicon pin microstrip sensors - methods to prevent from implantation damage

Wen Chin Tsay, Yen Ann Chen, Jyh Wong Hong, A. Chen, Willis T. Lin, Y. H. Chang, S. R. Hou, S. L. Hsu, C. R. Li, Hsien Jen Ting, Song Tsang Chiang

研究成果: 會議貢獻類型會議論文同行評審

摘要

Several 8×4cm2 sing-sided silicon microstrip sensors with capacitors coupling and polysilicon bias resistors have been fabricated by using the planar technology. Sirtl etch analysis revealed that the leakage current was caused by implantation damage. A boron solid source predeposition process had been developed to replace the p+ strip implantation. Several anneal technology had been studied to remove the implantation damage. The proto type sensors had been tested at the CERN SPS area. Test results showed that such a sensor is feasible.

原文???core.languages.en_GB???
頁面383-386
頁數4
出版狀態已出版 - 1995
事件Proceedings of the 1995 IEEE Region 10 International Conference on Microelectronics and VLSI, TENCON'95 - Hong Kong, Hong Kong
持續時間: 6 11月 199510 11月 1995

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???event.eventtypes.event.conference???Proceedings of the 1995 IEEE Region 10 International Conference on Microelectronics and VLSI, TENCON'95
城市Hong Kong, Hong Kong
期間6/11/9510/11/95

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