Single-grain Sn-rich micro-bump by reducing Sn undercooling with heterogeneous nucleation

Chieh Pu Tsai; Chung Yu Chiu; Wei Chieh Huang; Cheng Yi Liu; Jui Shen Chang; Chen Nan Chiu; Yao Chun Chuang

doi:10.1016/j.matlet.2023.135729

Single-grain Sn-rich micro-bump by reducing Sn undercooling with heterogeneous nucleation

Chieh Pu Tsai, Chung Yu Chiu, Wei Chieh Huang, Cheng Yi Liu, Jui Shen Chang, Chen Nan Chiu, Yao Chun Chuang

研究成果: 雜誌貢獻 › 期刊論文 › 同行評審

2 引文斯高帕斯（Scopus）

摘要

The heterogeneous nucleation on the limited (Pd,Ni)Sn₄ compound observed at the solder/Pd/Ni(P) interface greatly reduces the Sn undercooling. The undercooling reduction of Sn is the key resulting a single-grain structure for the Sn-rich Sn1.5Ag0.1Cu micro-bumps. Without (Pd,Ni)Sn₄ compound formed at the solder/Pd/Ni(P) interface, the Sn-rich Sn1.5Ag0.1Cu micro-bumps has a polycrystalline grain structure. Compared to the solder matrix with poly-grains structure, the single-grain solder matrix restricts electromigration atomic flux and the consumption of the Ni(P) layer, which mitigates EM effect and prolongs EM life time of the micro-bumps. Ni₃P layer formed at the solder/Pd/Ni(P) interface greatly influence EM behavior and lifetime.

原文	???core.languages.en_GB???
文章編號	135729
期刊	Materials Letters
卷	357
DOIs	https://doi.org/10.1016/j.matlet.2023.135729
出版狀態	已出版 - 15 2月 2024

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10.1016/j.matlet.2023.135729

開發製作具三維立體Cu6Sn5及(Cu,Ni)6Sn5化合物支架銲點的錫膏(2/3)
Liu, C.-Y. (PI)
1/08/23 → 31/07/24
研究計畫: Research

引用此

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title = "Single-grain Sn-rich micro-bump by reducing Sn undercooling with heterogeneous nucleation",

abstract = "The heterogeneous nucleation on the limited (Pd,Ni)Sn4 compound observed at the solder/Pd/Ni(P) interface greatly reduces the Sn undercooling. The undercooling reduction of Sn is the key resulting a single-grain structure for the Sn-rich Sn1.5Ag0.1Cu micro-bumps. Without (Pd,Ni)Sn4 compound formed at the solder/Pd/Ni(P) interface, the Sn-rich Sn1.5Ag0.1Cu micro-bumps has a polycrystalline grain structure. Compared to the solder matrix with poly-grains structure, the single-grain solder matrix restricts electromigration atomic flux and the consumption of the Ni(P) layer, which mitigates EM effect and prolongs EM life time of the micro-bumps. Ni3P layer formed at the solder/Pd/Ni(P) interface greatly influence EM behavior and lifetime.",

keywords = "Electromigration, Micro-bumps, Nucleation, Solidification, Undercooling",

author = "Tsai, {Chieh Pu} and Chiu, {Chung Yu} and Huang, {Wei Chieh} and Liu, {Cheng Yi} and Chang, {Jui Shen} and Chiu, {Chen Nan} and Chuang, {Yao Chun}",

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doi = "10.1016/j.matlet.2023.135729",

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T1 - Single-grain Sn-rich micro-bump by reducing Sn undercooling with heterogeneous nucleation

AU - Tsai, Chieh Pu

AU - Chiu, Chung Yu

AU - Huang, Wei Chieh

AU - Liu, Cheng Yi

AU - Chang, Jui Shen

AU - Chiu, Chen Nan

AU - Chuang, Yao Chun

PY - 2024/2/15

Y1 - 2024/2/15

N2 - The heterogeneous nucleation on the limited (Pd,Ni)Sn4 compound observed at the solder/Pd/Ni(P) interface greatly reduces the Sn undercooling. The undercooling reduction of Sn is the key resulting a single-grain structure for the Sn-rich Sn1.5Ag0.1Cu micro-bumps. Without (Pd,Ni)Sn4 compound formed at the solder/Pd/Ni(P) interface, the Sn-rich Sn1.5Ag0.1Cu micro-bumps has a polycrystalline grain structure. Compared to the solder matrix with poly-grains structure, the single-grain solder matrix restricts electromigration atomic flux and the consumption of the Ni(P) layer, which mitigates EM effect and prolongs EM life time of the micro-bumps. Ni3P layer formed at the solder/Pd/Ni(P) interface greatly influence EM behavior and lifetime.

AB - The heterogeneous nucleation on the limited (Pd,Ni)Sn4 compound observed at the solder/Pd/Ni(P) interface greatly reduces the Sn undercooling. The undercooling reduction of Sn is the key resulting a single-grain structure for the Sn-rich Sn1.5Ag0.1Cu micro-bumps. Without (Pd,Ni)Sn4 compound formed at the solder/Pd/Ni(P) interface, the Sn-rich Sn1.5Ag0.1Cu micro-bumps has a polycrystalline grain structure. Compared to the solder matrix with poly-grains structure, the single-grain solder matrix restricts electromigration atomic flux and the consumption of the Ni(P) layer, which mitigates EM effect and prolongs EM life time of the micro-bumps. Ni3P layer formed at the solder/Pd/Ni(P) interface greatly influence EM behavior and lifetime.

KW - Electromigration

KW - Micro-bumps

KW - Nucleation

KW - Solidification

KW - Undercooling

UR - http://www.scopus.com/inward/record.url?scp=85179890263&partnerID=8YFLogxK

U2 - 10.1016/j.matlet.2023.135729

DO - 10.1016/j.matlet.2023.135729

M3 - 期刊論文

AN - SCOPUS:85179890263

SN - 0167-577X

VL - 357

JO - Materials Letters

JF - Materials Letters

M1 - 135729

ER -

Single-grain Sn-rich micro-bump by reducing Sn undercooling with heterogeneous nucleation

摘要

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指紋

專案

開發製作具三維立體Cu6Sn5及(Cu,Ni)6Sn5化合物支架銲點的錫膏(2/3)

引用此