Single-grain Sn-rich micro-bump by reducing Sn undercooling with heterogeneous nucleation

Chieh Pu Tsai, Chung Yu Chiu, Wei Chieh Huang, Cheng Yi Liu, Jui Shen Chang, Chen Nan Chiu, Yao Chun Chuang

研究成果: 雜誌貢獻期刊論文同行評審

摘要

The heterogeneous nucleation on the limited (Pd,Ni)Sn4 compound observed at the solder/Pd/Ni(P) interface greatly reduces the Sn undercooling. The undercooling reduction of Sn is the key resulting a single-grain structure for the Sn-rich Sn1.5Ag0.1Cu micro-bumps. Without (Pd,Ni)Sn4 compound formed at the solder/Pd/Ni(P) interface, the Sn-rich Sn1.5Ag0.1Cu micro-bumps has a polycrystalline grain structure. Compared to the solder matrix with poly-grains structure, the single-grain solder matrix restricts electromigration atomic flux and the consumption of the Ni(P) layer, which mitigates EM effect and prolongs EM life time of the micro-bumps. Ni3P layer formed at the solder/Pd/Ni(P) interface greatly influence EM behavior and lifetime.

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文章編號135729
期刊Materials Letters
357
DOIs
出版狀態已出版 - 15 2月 2024

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