Simulation of interfacial cracking of the joint between glass-ceramic sealant and metallic interconnect in a planar solid oxide fuel cell stack

Chih Kuang Lin, Wei Hong Shiu, Si Han Wu, Ruey Yi Lee

研究成果: 書貢獻/報告類型會議論文篇章同行評審

1 引文 斯高帕斯(Scopus)

指紋

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Keyphrases

Engineering

Material Science