Scream for multi-level movable structures by inductively coupled plasma process

Yu Hsin Lin, Hung Ling Yin, Yung Yu Hsu, Yi Chiuen Hu, Hsiao Yu Chou, Tsung Hsun Yang

研究成果: 書貢獻/報告類型會議論文篇章同行評審

1 引文 斯高帕斯(Scopus)

摘要

A novel fabrication process to etch, to passivate, and to release single-crystal silicon structures totally in just only one process by inductively coupled plasma reactive ion etching (ICP-RIE) has been presented in this paper. Several kinds of movable actuators such as relay, comb-drive, and capacitance with thickness of 30• m have been fabricated successfully to demonstrate this fabrication process. Here, experimental investigations about fabrication parameters to get well profile and suspension structures are performed in a STS ICP-RIE system.

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主出版物標題Microelectromechanical Systems
發行者American Society of Mechanical Engineers (ASME)
頁面347-350
頁數4
ISBN(列印)0791836428, 9780791836422
DOIs
出版狀態已出版 - 2002

出版系列

名字ASME International Mechanical Engineering Congress and Exposition, Proceedings

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