@article{343d9a63a249424784a39c9b91430b3b,
title = "Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders",
abstract = "Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders was analyzed. The 5 μm Ni(P) was found to be consumed after 5 min of reflowing. The spalling of Ni-Sn compound grains enhanced the formation of a gap forming at the Ni3O/Cu interface.",
keywords = "Ni(P), Pb-free solder, Sn(Cu) alloys",
author = "Wang, {S. J.} and Liu, {C. Y.}",
note = "Funding Information: We like to thank the support from NSC (Taiwan National Science Council) and MOE Program for Promoting Academic Excellence of Universities under the grant number 91-E-FA06-1-4. Also, the authors would like to thank Prof. K.N. Tu (UCLA, USA) and Prof. Kao (Chem. and Materials Eng. at NCU, Taiwan) for very helpful discussions. ",
year = "2003",
month = nov,
doi = "10.1016/S1359-6462(03)00486-X",
language = "???core.languages.en_GB???",
volume = "49",
pages = "813--818",
journal = "Scripta Materialia",
issn = "1359-6462",
number = "9",
}