Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders

S. J. Wang, C. Y. Liu

研究成果: 雜誌貢獻期刊論文同行評審

69 引文 斯高帕斯(Scopus)

摘要

Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders was analyzed. The 5 μm Ni(P) was found to be consumed after 5 min of reflowing. The spalling of Ni-Sn compound grains enhanced the formation of a gap forming at the Ni3O/Cu interface.

原文???core.languages.en_GB???
頁(從 - 到)813-818
頁數6
期刊Scripta Materialia
49
發行號9
DOIs
出版狀態已出版 - 11月 2003

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