Research on an innovation hybrid machining process for the surface polishing of SiC wafer

Keyphrases

• Polishing Process 100%
• Surface Polishing 100%
• SiC Wafer 100%
• Hybrid Machining Process 100%
• Industrial Technology Research Institute 50%
• 4H-SiC Wafer 50%
• High Efficiency 33%
• Material Removal Rate 33%
• Ductile Mode 33%
• Vibration-assisted 33%
• Plasma Polishing 33%
• Taiwan 16%
• Surface Quality 16%
• Machining Process 16%
• Hybrid Process 16%
• High Surface Quality 16%
• Production Capacity 16%
• Machining Technology 16%
• High Production 16%
• Modification Process 16%
• Experimental Sample 16%
• Conventional Machining 16%
• High Material Removal Rate 16%
• Quality Production 16%
• Processing Area 16%
• C-face 16%
• Chemical Mechanical Polishing 16%
• Plasma Modification 16%

Engineering

• Polishing Process 100%
• Hybrid Machining Process 100%
• Material Removal Rate 50%
• Surface Quality 33%
• Ductile Mode 33%
• Experimental Result 16%
• Hybrid Process 16%
• Chemical Mechanical Polishing 16%

Material Science

• Machining 100%
• Surface (Surface Science) 100%
• Surface Property 40%
• Polishing 40%
• Chemical Mechanical Planarization 20%