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Research on an innovation hybrid machining process for the surface polishing of SiC wafer
Chia Jen Ting,
Chi Feng Chen
, Chih Chiang Weng, Ta Hsin Chou
機械工程學系
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Keyphrases
Polishing Process
100%
Surface Polishing
100%
SiC Wafer
100%
Hybrid Machining Process
100%
Industrial Technology Research Institute
50%
4H-SiC Wafer
50%
High Efficiency
33%
Material Removal Rate
33%
Ductile Mode
33%
Vibration-assisted
33%
Plasma Polishing
33%
Taiwan
16%
Surface Quality
16%
Machining Process
16%
Hybrid Process
16%
High Surface Quality
16%
Production Capacity
16%
Machining Technology
16%
High Production
16%
Modification Process
16%
Experimental Sample
16%
Conventional Machining
16%
High Material Removal Rate
16%
Quality Production
16%
Processing Area
16%
C-face
16%
Chemical Mechanical Polishing
16%
Plasma Modification
16%
Engineering
Polishing Process
100%
Hybrid Machining Process
100%
Material Removal Rate
50%
Surface Quality
33%
Ductile Mode
33%
Experimental Result
16%
Hybrid Process
16%
Chemical Mechanical Polishing
16%
Material Science
Machining
100%
Surface (Surface Science)
100%
Surface Property
40%
Polishing
40%
Chemical Mechanical Planarization
20%