Reliability of micro-interconnects in 3D IC packages

C. Robert Kao, Albert T. Wu, King Ning Tu, Yi Shao Lai

研究成果: 雜誌貢獻 › 編者言

8 引文斯高帕斯（Scopus）

原文	???core.languages.en_GB???
頁（從 - 到）	1
頁數	1
期刊	Microelectronics Reliability
卷	53
發行號	1
DOIs	https://doi.org/10.1016/j.microrel.2012.11.005
出版狀態	已出版 - 1月 2013

存取文件

@article{916ebdb0d25a45289ee67cab9cead4cf,

title = "Reliability of micro-interconnects in 3D IC packages",

author = "{Robert Kao}, C. and Wu, {Albert T.} and Tu, {King Ning} and Lai, {Yi Shao}",

year = "2013",

month = jan,

doi = "10.1016/j.microrel.2012.11.005",

language = "???core.languages.en_GB???",

volume = "53",

pages = "1",

journal = "Microelectronics Reliability",

issn = "0026-2714",

number = "1",

}

TY - JOUR

T1 - Reliability of micro-interconnects in 3D IC packages

AU - Robert Kao, C.

AU - Wu, Albert T.

AU - Tu, King Ning

AU - Lai, Yi Shao

PY - 2013/1

Y1 - 2013/1

UR - http://www.scopus.com/inward/record.url?scp=84872105777&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2012.11.005

DO - 10.1016/j.microrel.2012.11.005

M3 - 編者言

AN - SCOPUS:84872105777

SN - 0026-2714

VL - 53

SP - 1

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 1

ER -