Reliability of high-power LED packaging and assembly

Cheng Yi Liu, S. W. Ricky Lee, Moo Whan Shin, Yi Shao Lai

研究成果: 雜誌貢獻 › 編者言

1 引文斯高帕斯（Scopus）

原文	???core.languages.en_GB???
頁（從 - 到）	761
頁數	1
期刊	Microelectronics Reliability
卷	52
發行號	5
DOIs	https://doi.org/10.1016/j.microrel.2012.02.023
出版狀態	已出版 - 5月 2012

存取文件

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title = "Reliability of high-power LED packaging and assembly",

author = "Liu, {Cheng Yi} and {Ricky Lee}, {S. W.} and Shin, {Moo Whan} and Lai, {Yi Shao}",

year = "2012",

month = may,

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volume = "52",

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TY - JOUR

T1 - Reliability of high-power LED packaging and assembly

AU - Liu, Cheng Yi

AU - Ricky Lee, S. W.

AU - Shin, Moo Whan

AU - Lai, Yi Shao

PY - 2012/5

Y1 - 2012/5

UR - http://www.scopus.com/inward/record.url?scp=84860388018&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2012.02.023

DO - 10.1016/j.microrel.2012.02.023

M3 - 編者言

AN - SCOPUS:84860388018

SN - 0026-2714

VL - 52

SP - 761

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 5

ER -