Recent Advances in Thermoplastic Microfluidic Bonding

Kiran Giri, Chia Wen Tsao

研究成果: 雜誌貢獻回顧評介論文同行評審

1 引文 斯高帕斯(Scopus)

摘要

Microfluidics is a multidisciplinary technology with applications in various fields, such as biomedical, energy, chemicals and environment. Thermoplastic is one of the most prominent materials for polymer microfluidics. Properties such as good mechanical rigidity, organic solvent resistivity, acid/base resistivity, and low water absorbance make thermoplastics suitable for various microfluidic applications. However, bonding of thermoplastics has always been challenging because of a wide range of bonding methods and requirements. This review paper summarizes the current bonding processes being practiced for the fabrication of thermoplastic microfluidic devices, and provides a comparison between the different bonding strategies to assist researchers in finding appropriate bonding methods for microfluidic device assembly.

原文???core.languages.en_GB???
文章編號486
期刊Micromachines
13
發行號3
DOIs
出版狀態已出版 - 3月 2022

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