Power consumption reduction scheme of magnetic microactuation using electroplated Cu-Ni nanocomposite

Yu Wen Huang, Tzu Yuan Chao, C. C. Chen, Y. T. Cheng

研究成果: 雜誌貢獻期刊論文同行評審

16 引文 斯高帕斯(Scopus)

摘要

This letter presents a power consumption reduction scheme of magnetic microactuation using Cu-Ni nanocomposite film which is electroplated in alkaline noncyanide based Ni colloidal copper plating solution at 40 °C. The superconducting quantum interference device magnetometer measurements show that Cu film is modified from diamagnetism to ferromagnetism via the incorporation of Ni ferromagnetic nanoparticles into itself to form a Cu-Ni nanocomposite film. A magnetic microactuator made of the nanocomposite can have about 9% performance improvement in terms of actuation enlargement. In other words, the coil made of the Cu-Ni nanocomposite can exhibit better power efficiency for the same output displacement.

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文章編號244105
期刊Applied Physics Letters
90
發行號24
DOIs
出版狀態已出版 - 2007

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