@inproceedings{9258f25589f14fd4a006d640a16c7c90,
title = "Physical characteristics of nanoscale titanium-aluminum alloy powder during 3D printing laser sintering process - A molecular dynamics study",
abstract = "In the study, the molecular dynamics simulation method is utilized to investigate the physical characteristics of nanoscale titanium aluminum alloy powder during 3D printing (additive manufacturing) powder bed fusion laser sintering process. The radius of gyration, neck width and root mean square of different powder size of nanoscale titanium aluminum alloy powder during 3D printing laser sintering process under different heating rate is analyzed and discussed. The physical characteristics of nanoscale solid/hollow spherical titanium aluminum binary alloy powder are simulated, and the neck width and internal lattice changes are also observed. It is found that the phenomena of spontaneous solid-state sintering is occurred at room temperature whatever solid or hollow spherical titanium-aluminum alloy nanoscale powder. It is observed that the temperature of solid state diffusion decrease with heating rate increasing, but the temperature of that increase with powder size decreasing. It is found that the coalescence temperature of nanoscale solid titanium aluminum alloy powder is range of between 940K and 1700K, and the melting temperature of that is range of between 1600K and 1770K. It is also observed that the coalescence temperature of nanoscale hollow coalescence temperature is range of between 1050K and 1580K, and the melting temperature of that is range of between 1450K and 1630K.",
keywords = "3D Printing, Molecular Dynamics, Nanoscale Alloy Powder",
author = "Lai, {Ling Feng} and Lu, {Deng Maw} and Li, {Chun Hsien} and Chen, {Kun Hsien} and Lin, {Shun Chang} and Su, {Yu Chen} and Shan Jiang and Liu, {Day Shan} and Hsu, {Kuei Shu} and Lu, {Jian Ming} and Lee, {Ming Hsiao} and Zhen Chen",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 4th IEEE International Conference on Applied System Innovation, ICASI 2018 ; Conference date: 13-04-2018 Through 17-04-2018",
year = "2018",
month = jun,
day = "22",
doi = "10.1109/ICASI.2018.8394537",
language = "???core.languages.en_GB???",
series = "Proceedings of 4th IEEE International Conference on Applied System Innovation 2018, ICASI 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1318--1321",
editor = "Lam, {Artde Donald Kin-Tak} and Prior, {Stephen D.} and Teen-Hang Meen",
booktitle = "Proceedings of 4th IEEE International Conference on Applied System Innovation 2018, ICASI 2018",
}