PCB embedded capacitor with central via connection structure for RF application

Chang Sheng Chen, Yo Shen Lin, Wei Ting Chen, Chin Sun Shyu, Shinn Juh Lay, Min Lin Lee

研究成果: 書貢獻/報告類型會議論文篇章同行評審

1 引文 斯高帕斯(Scopus)

摘要

Although PCB embedded passives technology has been studied for several years, there are still many researches continuing to make it more complete and applicable. This work focus on the electrical performance of MIM (metal-insulator- metal) type embedded capacitor. For high frequency application, the self-resonance frequency (SRF) is an important design parameter. Different I/O connection types and positions on the electrode will change the parasitic effect and thus affect SRF. In this paper, an embedded capacitor with central via connection is utilized to enhance the SRF. Since the coupling effect from other nearby components also degrades the characteristic of embedded capacitor, a shielding structure for PCB embedded capacitor is designed to prevent the interference from internal high density routing and keep good electrical performance.

原文???core.languages.en_GB???
主出版物標題2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
頁面77-80
頁數4
DOIs
出版狀態已出版 - 2008
事件2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Seoul, Korea, Republic of
持續時間: 10 12月 200812 12月 2008

出版系列

名字2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings

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???event.eventtypes.event.conference???2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
國家/地區Korea, Republic of
城市Seoul
期間10/12/0812/12/08

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