TY - JOUR
T1 - Pattern of vertical engineering collaboration between foundry and design service provider
AU - Su, Yea Huey
AU - Guo, Ruey Shan
AU - Hsiao, Chia Hsien
PY - 2005
Y1 - 2005
N2 - As IC design and manufacturing complexities continue to increase exponentially, it is becoming less practical for a single company to provide products and services without collaborated partners. The goal of this research is then to explore how foundries and design service providers collaborate with each other under the new business paradigm. By conducting field interviews and empirical study on six collaboration cases, this research proposes four different collaboration patterns, which are: Complementary-Equity collaboration pattern, Agent-Equity collaboration pattern, Complementary-Nonequity collaboration pattern, and Agent-nonequity collaboration pattern. There are several findings: 1) When both parties have stronger complementary assets relationship, the transaction cost is lower and the relationship is more stable; 2) Long-term partnership and timing governance mechanism reduce negotiation effort and facilitate quick time-to-market; 3) Closer collaboration process can significantly reduce the errors in design project.
AB - As IC design and manufacturing complexities continue to increase exponentially, it is becoming less practical for a single company to provide products and services without collaborated partners. The goal of this research is then to explore how foundries and design service providers collaborate with each other under the new business paradigm. By conducting field interviews and empirical study on six collaboration cases, this research proposes four different collaboration patterns, which are: Complementary-Equity collaboration pattern, Agent-Equity collaboration pattern, Complementary-Nonequity collaboration pattern, and Agent-nonequity collaboration pattern. There are several findings: 1) When both parties have stronger complementary assets relationship, the transaction cost is lower and the relationship is more stable; 2) Long-term partnership and timing governance mechanism reduce negotiation effort and facilitate quick time-to-market; 3) Closer collaboration process can significantly reduce the errors in design project.
UR - http://www.scopus.com/inward/record.url?scp=28744434797&partnerID=8YFLogxK
U2 - 10.1109/issm.2005.1513378
DO - 10.1109/issm.2005.1513378
M3 - 會議論文
AN - SCOPUS:28744434797
SN - 1523-553X
SP - 361
EP - 364
JO - IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings
JF - IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings
M1 - MS300
T2 - IEEE International Symposium on Semiconductor Manufacturing, Conference Proceedings
Y2 - 13 September 2005 through 15 September 2005
ER -