Optical interconnects integration on FR4 board with MSM photodetector and commercial optoelectronic devices

Zhaoran Huang; Daniel Guidotti; Gee Kung Chang; Jin Liu; Fuhan Liu; Y. J. Chang; Rao Tummala

Optical interconnects integration on FR4 board with MSM photodetector and commercial optoelectronic devices

Zhaoran Huang, Daniel Guidotti, Gee Kung Chang, Jin Liu, Fuhan Liu, Y. J. Chang, Rao Tummala

光電科學與工程學系

研究成果: 雜誌貢獻 › 會議論文 › 同行評審

1 引文斯高帕斯（Scopus）

摘要

The optical Integration on FR4 board with Metal semiconductor Metal (MSM) photodetector and commercial optoelectronic devices is discussed. The MSM photodetector is fabricated on InGaAs material with an absorbing layer thickness of 300 nm. The bonding pads for the MSM detectors are formed on the undercladding. The results show that the spin coating and curing of polymer waveguide results in the formation of 30 micrometre thick and 3.8 centimetre long core channel.

原文	???core.languages.en_GB???
頁（從 - 到）	13-14
頁數	2
期刊	LEOS Summer Topical Meeting
出版狀態	已出版 - 2004
事件	2004 Digest of the LEOS Summer Topical Meetings - San Diego, CA, United States 持續時間: 28 7月 2004 → 30 7月 2004

引用此

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title = "Optical interconnects integration on FR4 board with MSM photodetector and commercial optoelectronic devices",

abstract = "The optical Integration on FR4 board with Metal semiconductor Metal (MSM) photodetector and commercial optoelectronic devices is discussed. The MSM photodetector is fabricated on InGaAs material with an absorbing layer thickness of 300 nm. The bonding pads for the MSM detectors are formed on the undercladding. The results show that the spin coating and curing of polymer waveguide results in the formation of 30 micrometre thick and 3.8 centimetre long core channel.",

author = "Zhaoran Huang and Daniel Guidotti and Chang, {Gee Kung} and Jin Liu and Fuhan Liu and Chang, {Y. J.} and Rao Tummala",

year = "2004",

language = "???core.languages.en_GB???",

pages = "13--14",

journal = "LEOS Summer Topical Meeting",

issn = "1099-4742",

note = "2004 Digest of the LEOS Summer Topical Meetings ; Conference date: 28-07-2004 Through 30-07-2004",

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TY - JOUR

T1 - Optical interconnects integration on FR4 board with MSM photodetector and commercial optoelectronic devices

AU - Huang, Zhaoran

AU - Guidotti, Daniel

AU - Chang, Gee Kung

AU - Liu, Jin

AU - Liu, Fuhan

AU - Chang, Y. J.

AU - Tummala, Rao

PY - 2004

Y1 - 2004

N2 - The optical Integration on FR4 board with Metal semiconductor Metal (MSM) photodetector and commercial optoelectronic devices is discussed. The MSM photodetector is fabricated on InGaAs material with an absorbing layer thickness of 300 nm. The bonding pads for the MSM detectors are formed on the undercladding. The results show that the spin coating and curing of polymer waveguide results in the formation of 30 micrometre thick and 3.8 centimetre long core channel.

AB - The optical Integration on FR4 board with Metal semiconductor Metal (MSM) photodetector and commercial optoelectronic devices is discussed. The MSM photodetector is fabricated on InGaAs material with an absorbing layer thickness of 300 nm. The bonding pads for the MSM detectors are formed on the undercladding. The results show that the spin coating and curing of polymer waveguide results in the formation of 30 micrometre thick and 3.8 centimetre long core channel.

UR - http://www.scopus.com/inward/record.url?scp=4544324965&partnerID=8YFLogxK

M3 - 會議論文

AN - SCOPUS:4544324965

SN - 1099-4742

SP - 13

EP - 14

JO - LEOS Summer Topical Meeting

JF - LEOS Summer Topical Meeting

T2 - 2004 Digest of the LEOS Summer Topical Meetings

Y2 - 28 July 2004 through 30 July 2004

ER -

Optical interconnects integration on FR4 board with MSM photodetector and commercial optoelectronic devices

摘要

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