On thermomechanical properties of Au-Ag-Pd-Cu-Si bulk metallic glass

T. W. Tang, Y. C. Chang, J. C. Huang, Q. Gao, J. S.C. Jang, Chi Y.A. Tsao

研究成果: 雜誌貢獻期刊論文同行評審

17 引文 斯高帕斯(Scopus)

摘要

The viscosity behavior and formability of the Au49Ag5.5Pd2.3Cu26.9Si16.3 bulk metallic glass within the supercooled liquid temperature region are examined using thermomechanical analyzer (TMA). The viscosity values of the Au-based BMG within 440-470 K lies within 2 × 107 and 1 × 108 Pa s, a reasonable viscosity level for macro- or micro-forming. The low working temperature of ∼450 K and the low working pressure less than 1 MPa, coupled with the sufficient hardness of ∼350 Hv, stress level of ∼1100 MPa, and anti-oxidation and anti-corrosion capability, would be highly promising for micro-forming or micro-imprinting for the micro-electro-mechanical systems.

原文???core.languages.en_GB???
頁(從 - 到)569-572
頁數4
期刊Materials Chemistry and Physics
116
發行號2-3
DOIs
出版狀態已出版 - 15 8月 2009

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