On thermomechanical properties of Au-Ag-Pd-Cu-Si bulk metallic glass

T. W. Tang; Y. C. Chang; J. C. Huang; Q. Gao; J. S.C. Jang; Chi Y.A. Tsao

doi:10.1016/j.matchemphys.2009.04.032

On thermomechanical properties of Au-Ag-Pd-Cu-Si bulk metallic glass

T. W. Tang, Y. C. Chang, J. C. Huang, Q. Gao, J. S.C. Jang, Chi Y.A. Tsao

材料科學與工程研究所

研究成果: 雜誌貢獻 › 期刊論文 › 同行評審

18 引文斯高帕斯（Scopus）

摘要

The viscosity behavior and formability of the Au₄₉Ag_5.5Pd_2.3Cu_26.9Si_16.3 bulk metallic glass within the supercooled liquid temperature region are examined using thermomechanical analyzer (TMA). The viscosity values of the Au-based BMG within 440-470 K lies within 2 × 10⁷ and 1 × 10⁸ Pa s, a reasonable viscosity level for macro- or micro-forming. The low working temperature of ∼450 K and the low working pressure less than 1 MPa, coupled with the sufficient hardness of ∼350 H_v, stress level of ∼1100 MPa, and anti-oxidation and anti-corrosion capability, would be highly promising for micro-forming or micro-imprinting for the micro-electro-mechanical systems.

原文	???core.languages.en_GB???
頁（從 - 到）	569-572
頁數	4
期刊	Materials Chemistry and Physics
卷	116
發行號	2-3
DOIs	https://doi.org/10.1016/j.matchemphys.2009.04.032
出版狀態	已出版 - 15 8月 2009

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10.1016/j.matchemphys.2009.04.032

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@article{ee244e0426d949d7980ee6e35289a58e,

title = "On thermomechanical properties of Au-Ag-Pd-Cu-Si bulk metallic glass",

abstract = "The viscosity behavior and formability of the Au49Ag5.5Pd2.3Cu26.9Si16.3 bulk metallic glass within the supercooled liquid temperature region are examined using thermomechanical analyzer (TMA). The viscosity values of the Au-based BMG within 440-470 K lies within 2 × 107 and 1 × 108 Pa s, a reasonable viscosity level for macro- or micro-forming. The low working temperature of ∼450 K and the low working pressure less than 1 MPa, coupled with the sufficient hardness of ∼350 Hv, stress level of ∼1100 MPa, and anti-oxidation and anti-corrosion capability, would be highly promising for micro-forming or micro-imprinting for the micro-electro-mechanical systems.",

keywords = "Amorphous materials, Thermal properties, Thermo-mechanical analysis (TMA), Thermomechanical effects",

author = "Tang, {T. W.} and Chang, {Y. C.} and Huang, {J. C.} and Q. Gao and Jang, {J. S.C.} and Tsao, {Chi Y.A.}",

note = "Funding Information: The authors gratefully acknowledge the sponsorship by National Science Council of Taiwan, ROC, under the Project No. NSC 95–2218-E-110–006. ",

year = "2009",

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day = "15",

doi = "10.1016/j.matchemphys.2009.04.032",

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volume = "116",

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T1 - On thermomechanical properties of Au-Ag-Pd-Cu-Si bulk metallic glass

AU - Tang, T. W.

AU - Chang, Y. C.

AU - Huang, J. C.

AU - Gao, Q.

AU - Jang, J. S.C.

AU - Tsao, Chi Y.A.

N1 - Funding Information: The authors gratefully acknowledge the sponsorship by National Science Council of Taiwan, ROC, under the Project No. NSC 95–2218-E-110–006.

PY - 2009/8/15

Y1 - 2009/8/15

N2 - The viscosity behavior and formability of the Au49Ag5.5Pd2.3Cu26.9Si16.3 bulk metallic glass within the supercooled liquid temperature region are examined using thermomechanical analyzer (TMA). The viscosity values of the Au-based BMG within 440-470 K lies within 2 × 107 and 1 × 108 Pa s, a reasonable viscosity level for macro- or micro-forming. The low working temperature of ∼450 K and the low working pressure less than 1 MPa, coupled with the sufficient hardness of ∼350 Hv, stress level of ∼1100 MPa, and anti-oxidation and anti-corrosion capability, would be highly promising for micro-forming or micro-imprinting for the micro-electro-mechanical systems.

AB - The viscosity behavior and formability of the Au49Ag5.5Pd2.3Cu26.9Si16.3 bulk metallic glass within the supercooled liquid temperature region are examined using thermomechanical analyzer (TMA). The viscosity values of the Au-based BMG within 440-470 K lies within 2 × 107 and 1 × 108 Pa s, a reasonable viscosity level for macro- or micro-forming. The low working temperature of ∼450 K and the low working pressure less than 1 MPa, coupled with the sufficient hardness of ∼350 Hv, stress level of ∼1100 MPa, and anti-oxidation and anti-corrosion capability, would be highly promising for micro-forming or micro-imprinting for the micro-electro-mechanical systems.

KW - Amorphous materials

KW - Thermal properties

KW - Thermo-mechanical analysis (TMA)

KW - Thermomechanical effects

UR - http://www.scopus.com/inward/record.url?scp=67349103428&partnerID=8YFLogxK

U2 - 10.1016/j.matchemphys.2009.04.032

DO - 10.1016/j.matchemphys.2009.04.032

M3 - 期刊論文

AN - SCOPUS:67349103428

SN - 0254-0584

VL - 116

SP - 569

EP - 572

JO - Materials Chemistry and Physics

JF - Materials Chemistry and Physics

IS - 2-3

ER -

On thermomechanical properties of Au-Ag-Pd-Cu-Si bulk metallic glass

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