On test and repair of 3D random access memory

Cheng Wen Wu, Shyue Kun Lu, Jin Fu Li

研究成果: 書貢獻/報告類型會議論文篇章同行評審

13 引文 斯高帕斯(Scopus)

摘要

The three-dimensional (3D) random access memory (RAM) using through-silicon via (TSV) has been considered as a promising approach to overcome the memory wall. However, cost and yield are two key issues for volume production of 3D RAMs, and yield enhancement increasingly requires test techniques. In this paper, we first introduce issues and existing techniques for the testing and yield enhancement of 3D RAMs. Then, a built-in self-repair (BISR) technique for 3D RAM using global redundancy is presented. According to the redundancy analysis results of each die with the BISR circuit, the die-to-die (d2d) and wafer-to-wafer (w2w) stacking problems are transferred to the bipartite maximal matching problem. Then, heuristic algorithms are also proposed to optimize the stacking yield.

原文???core.languages.en_GB???
主出版物標題ASP-DAC 2012 - 17th Asia and South Pacific Design Automation Conference
頁面744-749
頁數6
DOIs
出版狀態已出版 - 2012
事件17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012 - Sydney, NSW, Australia
持續時間: 30 1月 20122 2月 2012

出版系列

名字Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

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???event.eventtypes.event.conference???17th Asia and South Pacific Design Automation Conference, ASP-DAC 2012
國家/地區Australia
城市Sydney, NSW
期間30/01/122/02/12

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