Nucleation and propagation of voids in microbumps for 3 dimensional integrated circuits

Hsueh Hsien Hsu, Shin Yi Huang, Tao Chih Chang, Albert T. Wu

研究成果: 雜誌貢獻期刊論文同行評審

16 引文 斯高帕斯(Scopus)

摘要

The shrinking solder dimensions greatly impact the reliability of devices and increase entire failure modes. Limited solder volumes can be consumed completely and transformed into intermetallic compound (IMC) microbumps. Microvoids surface when microbumps are formed and may be attributed to a mismatch of the thermal expansion coefficient between the constituents. After thermal aging at 150 °C, the stress induced by the growth of IMCs relaxes and enhances propagation of the cracks along the middle of the bumps. The brittle nature of the IMC showed minimal resistance to cracks and incurred a failure mode.

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文章編號251913
期刊Applied Physics Letters
99
發行號25
DOIs
出版狀態已出版 - 19 12月 2011

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