Novel solid-state pressureless approach for Cu-embedded intermetallic interconnects at low temperature

Kuo Shuo Huang, Tzu Hao Shen, Wei Liu, Jui Lin Chao, Albert T. Wu

研究成果: 雜誌貢獻 › 期刊論文 › 同行評審

1 引文 斯高帕斯（Scopus）

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Keyphrases

Engineering

Earth and Planetary Sciences

Immunology and Microbiology

Material Science