Nano-scaled Ge FinFETs with low temperature ferroelectric HfZrOx on specific interfacial layers exhibiting 65% S.S. reduction and improved ION

C. J. Su, Y. T. Tang, Y. C. Tsou, P. J. Sung, F. J. Hou, C. J. Wang, S. T. Chung, C. Y. Hsieh, Y. S. Yeh, F. K. Hsueh, K. H. Kao, S. S. Chuang, C. T. Wu, T. Y. You, Y. L. Jian, T. H. Chou, Y. L. Shen, B. Y. Chen, G. L. Luo, T. C. HongK. P. Huang, M. C. Chen, Y. J. Lee, T. S. Chao, T. Y. Tseng, W. F. Wu, G. W. Huang, J. M. Shieh, W. K. Yeh, Y. H. Wang

研究成果: 書貢獻/報告類型會議論文篇章同行評審

30 引文 斯高帕斯(Scopus)

摘要

Ge n- and p-FinFETs with different interfacial layer ferroelectric HfZrOx (IL-FE-HZO) gate stacks have been demonstrated systematically by various annealing conditions for the first time. Microwave annealing (MWA) not only shows enhanced FE characteristics but also suppresses the gate leakage and Ge interdiffusion compared with conventional rapid thermal annealing (RTA). While HZO on Al2O3 IL results in paraelectric behavior, HZO on GeOx IL exhibits significant FE. High Ion/Ioff (> 107) and low subthreshold slope (S.S. ∼ 58 mV/dec.) are demonstrated by a Ge nFinFET with a gate length (Lg) of 60 nm and a FE-HZO/GeOx gate stack.

原文???core.languages.en_GB???
主出版物標題2017 Symposium on VLSI Technology, VLSI Technology 2017
發行者Institute of Electrical and Electronics Engineers Inc.
頁面T152-T153
ISBN(電子)9784863486058
DOIs
出版狀態已出版 - 31 7月 2017
事件37th Symposium on VLSI Technology, VLSI Technology 2017 - Kyoto, Japan
持續時間: 5 6月 20178 6月 2017

出版系列

名字Digest of Technical Papers - Symposium on VLSI Technology
ISSN(列印)0743-1562

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???event.eventtypes.event.conference???37th Symposium on VLSI Technology, VLSI Technology 2017
國家/地區Japan
城市Kyoto
期間5/06/178/06/17

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