Nano-scaled creep response of TiAlV low density medium entropy alloy at elevated temperatures

Xiangkai Zhang, Hanting Ye, Jacob C. Huang, Taiyou Liu, Pinhung Lin, Yaocheng Wu, Mintsang Tsai, Yuchin Liao, Jason S.C. Jang

研究成果: 雜誌貢獻期刊論文同行評審

4 引文 斯高帕斯(Scopus)

摘要

A low density, medium entropy alloy (LD-MEA) Ti33Al33V34 (4.44 g/cm3) was successfully developed. The microstructure was found to be composed of a disordered body-centered-cubic (BCC) matrix and minor ordered B2 precipitates based on transmission electron microscopy characterization. Equilibrium and non-equilibrium modeling, simulated using the Calphad approach, were applied to predict the phase constituent. Creep behavior of (110) grains at elevated temperatures was investigated by nanoindentation and the results were compared with Cantor alloy and Ti-6Al-4V alloy. Dislocation creep was found to be the dominant mechanism. The decreasing trend of hardness in (110) grains of BCC TiAlV is different from that in (111) grains of face-centered-cubic (FCC) Cantor alloy due to the different temperature-dependence of Peierls stress in these two lattice structures. The activation energy value of (110) grains was lower than that of (111) grains in FCC Cantor alloy because of the denser atomic stacking in FCC alloys. Compared with conventional Ti-6Al-4V alloy, TiAlV possesses considerably higher hardness and specific strength (63% higher), 83% lower creep displacement at room temperature, and 50% lower creep strain rate over the temperature range from 500 to 600 °C under the similar 1150 MPa stress, indicating a promising substitution for Ti-6Al-4V alloy as structural materials.

原文???core.languages.en_GB???
文章編號36
期刊Materials
13
發行號1
DOIs
出版狀態已出版 - 1 1月 2020

指紋

深入研究「Nano-scaled creep response of TiAlV low density medium entropy alloy at elevated temperatures」主題。共同形成了獨特的指紋。

引用此