Multifunctional integrated substrate technology for high density SOP packaging

Keyphrases

• 10Gbps 25%
• 3D Packaging 25%
• Advanced Package 25%
• ChIP-chip 50%
• Chip-level 25%
• Clock Frequency 25%
• Component Integration 25%
• Fine Line 25%
• Fine pitch 25%
• Flip chip 50%
• Georgia Tech 25%
• High Density 100%
• High Performance 50%
• High Performance Work Systems 50%
• High-density System 100%
• High-density Wiring 75%
• High-speed Optical Interconnect 25%
• IC Packaging 25%
• In-package 25%
• Integrated Substrate 100%
• Microelectronic Systems 25%
• Microsystems 50%
• Microvia 50%
• Miniaturization 25%
• Nanometer Size 25%
• Next Generation Systems 25%
• Non-conformal 25%
• Optical Components 25%
• Optoelectronic Integration 25%
• Organic Surfaces 25%
• Package Substrate 25%
• Package System 25%
• Package-on-package 100%
• Passive Component 25%
• Passive Integration 25%
• Performance Requirements 25%
• Printed Circuit Board 100%
• Speed Increase 25%
• Substrate Technology 100%
• System Application 25%
• System Development 25%
• System Level 25%
• Technology Integration 25%
• Ultra-high 25%
• Ultra-high Density 50%
• Ultrafine 50%
• Wafer Level Package 25%
• Wire Technology 75%
• Wiring 50%

Engineering

• Clock Speed 25%
• Data Link 25%
• Data Rate 25%
• Feature Size 25%
• Generation System 25%
• Microelectronics 25%
• Microsystem 50%
• Microvias 50%
• Nanometre 25%
• Optical Interconnect 25%
• Optoelectronics 25%
• Passive Component 25%
• Performance Requirement 25%
• Printed Circuit Board 100%
• System-in-Package 25%
• System-on-Package 100%
• Systems Performance 50%