Multifunctional integrated substrate technology for high density SOP packaging

Fuhan Liu, Rao R. Tummala, Venky Sundaram, Daniel Guidotti, Zhaoran Huang, Y. J. Chang, Isaac Robin Abothu, P. M. Raj, Swapan Bhattacharya, Devarajan Balaraman, G. K. Chang

研究成果: 書貢獻/報告類型會議論文篇章同行評審

4 引文 斯高帕斯(Scopus)

指紋

深入研究「Multifunctional integrated substrate technology for high density SOP packaging」主題。共同形成了獨特的指紋。

Engineering & Materials Science