Keyphrases
High Density
100%
Printed Circuit Board
100%
Substrate Technology
100%
High-density System
100%
Integrated Substrate
100%
Package-on-package
100%
High-density Wiring
75%
Wire Technology
75%
High Performance
50%
Flip chip
50%
Wiring
50%
Microsystems
50%
High Performance Work Systems
50%
Ultrafine
50%
ChIP-chip
50%
Ultra-high Density
50%
Microvia
50%
Performance Requirements
25%
Ultra-high
25%
System Development
25%
Clock Frequency
25%
10Gbps
25%
Chip-level
25%
Passive Component
25%
Technology Integration
25%
Optical Components
25%
System Level
25%
Miniaturization
25%
Nanometer Size
25%
In-package
25%
System Application
25%
Wafer Level Package
25%
3D Packaging
25%
High-speed Optical Interconnect
25%
Speed Increase
25%
Advanced Package
25%
Next Generation Systems
25%
Package Substrate
25%
Microelectronic Systems
25%
IC Packaging
25%
Georgia Tech
25%
Passive Integration
25%
Organic Surfaces
25%
Optoelectronic Integration
25%
Package System
25%
Fine pitch
25%
Component Integration
25%
Fine Line
25%
Non-conformal
25%
Engineering
Printed Circuit Board
100%
System-on-Package
100%
Systems Performance
50%
Microsystem
50%
Microvias
50%
Performance Requirement
25%
Feature Size
25%
Data Rate
25%
Nanometre
25%
Microelectronics
25%
Optical Interconnect
25%
Optoelectronics
25%
Passive Component
25%
Generation System
25%
System-in-Package
25%
Data Link
25%
Clock Speed
25%