Modeling the valuation process of sIlicon intellectual property in the semiconductor industry

C. L. Hung, Y. H. Su, Alfred L.P. Cheng

研究成果: 書貢獻/報告類型會議論文篇章同行評審

1 引文 斯高帕斯(Scopus)

摘要

The complexity of IC (Integrated Circuit) design increases as semiconductor fabrication miniaturizes. Assembly of the reusable basic components of the IC design process has become valuable in accelerating development and marketing of new IC applications. As a result, the idea of SIP (Silicon Intellectual Property) has emerged to meet this demand. The purpose of this paper is to develop a SIP valuation model. However, assessing such intangible assets cost high and have a time-consuming negotiation process to safeguard performance. After intensive interviews with SIP providers, we model a SIP valuation process, which incorporates with quality signals, links to the SIP info-mediaries, and augments with the industry dynamics. The results are further suggested to support with Internet SIP malls, which are installed to take the advantages of multimedia interface and real-time archive for facilitating the SIP valuation processes.

原文???core.languages.en_GB???
主出版物標題IEEM 2007
主出版物子標題2007 IEEE International Conference on Industrial Engineering and Engineering Management
頁面592-596
頁數5
DOIs
出版狀態已出版 - 2007
事件2007 IEEE International Conference on Industrial Engineering and Engineering Management, IEEM 2007 - , Singapore
持續時間: 2 12月 20074 12月 2007

出版系列

名字IEEM 2007: 2007 IEEE International Conference on Industrial Engineering and Engineering Management

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???event.eventtypes.event.conference???2007 IEEE International Conference on Industrial Engineering and Engineering Management, IEEM 2007
國家/地區Singapore
期間2/12/074/12/07

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