Modeling and testing comparison faults of memristive ternary content addressable memories

Li Wei Deng; Jin Fu Li; Yong Xiao Chen

doi:10.1109/ETS.2018.8400695

Modeling and testing comparison faults of memristive ternary content addressable memories

Li Wei Deng, Jin Fu Li, Yong Xiao Chen

電機工程學系

研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審

1 引文斯高帕斯（Scopus）

摘要

Ternary content addressable memory (TCAM) is widely used for the network applications. However, TCAM is a power-and area-consuming component. Memristor-based TCAM is considered as a good alternative for reducing the required power and area. In this paper, we define comparison faults of 5T2R memristor-based TCAMs. Electrical defects such as transistor stuck-open/stuck-on, resistive open, short, and bridge are comprehensively injected and simulated by Hspice. We also propose a March-like test March-MCAM to fully cover the defined comparison faults. March-MCAM requires 6N Write operations and (14N + 2B) Compare operations for an N × B-bit mrTCAM.

原文	???core.languages.en_GB???
主出版物標題	Proceedings - 2018 23rd IEEE European Test Symposium, ETS 2018
發行者	Institute of Electrical and Electronics Engineers Inc.
頁面	1-6
頁數	6
ISBN（電子）	9781538637289
DOIs	https://doi.org/10.1109/ETS.2018.8400695
出版狀態	已出版 - 29 6月 2018
事件	23rd IEEE European Test Symposium, ETS 2018 - Bremen, Germany 持續時間: 28 5月 2018 → 1 6月 2018

出版系列

名字	Proceedings of the European Test Workshop
卷	2018-May
ISSN（列印）	1530-1877
ISSN（電子）	1558-1780

???event.eventtypes.event.conference???

???event.eventtypes.event.conference???	23rd IEEE European Test Symposium, ETS 2018
國家/地區	Germany
城市	Bremen
期間	28/05/18 → 1/06/18

存取文件

10.1109/ETS.2018.8400695

堆疊式記憶體測試與可靠度增強技術(2/3)
Li, J.-F. (PI)
1/08/17 → 31/07/18
研究計畫: Research
應用於物聯網之新興非揮發性記憶體測試技術(2/3)
Li, J.-F. (PI)
1/08/17 → 31/07/18
研究計畫: Research

引用此

Deng, L. W., Li, J. F., & Chen, Y. X. (2018). Modeling and testing comparison faults of memristive ternary content addressable memories. 於 Proceedings - 2018 23rd IEEE European Test Symposium, ETS 2018 (頁 1-6). (Proceedings of the European Test Workshop; 卷 2018-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ETS.2018.8400695

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title = "Modeling and testing comparison faults of memristive ternary content addressable memories",

abstract = "Ternary content addressable memory (TCAM) is widely used for the network applications. However, TCAM is a power-and area-consuming component. Memristor-based TCAM is considered as a good alternative for reducing the required power and area. In this paper, we define comparison faults of 5T2R memristor-based TCAMs. Electrical defects such as transistor stuck-open/stuck-on, resistive open, short, and bridge are comprehensively injected and simulated by Hspice. We also propose a March-like test March-MCAM to fully cover the defined comparison faults. March-MCAM requires 6N Write operations and (14N + 2B) Compare operations for an N × B-bit mrTCAM.",

author = "Deng, {Li Wei} and Li, {Jin Fu} and Chen, {Yong Xiao}",

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Deng, LW, Li, JF & Chen, YX 2018, Modeling and testing comparison faults of memristive ternary content addressable memories. 於 Proceedings - 2018 23rd IEEE European Test Symposium, ETS 2018. Proceedings of the European Test Workshop, 卷 2018-May, Institute of Electrical and Electronics Engineers Inc., 頁 1-6, 23rd IEEE European Test Symposium, ETS 2018, Bremen, Germany, 28/05/18. https://doi.org/10.1109/ETS.2018.8400695

Modeling and testing comparison faults of memristive ternary content addressable memories. / Deng, Li Wei; Li, Jin Fu; Chen, Yong Xiao.
Proceedings - 2018 23rd IEEE European Test Symposium, ETS 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1-6 (Proceedings of the European Test Workshop; 卷 2018-May).

研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審

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Modeling and testing comparison faults of memristive ternary content addressable memories

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出版系列

???event.eventtypes.event.conference???

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指紋

專案

堆疊式記憶體測試與可靠度增強技術(2/3)

應用於物聯網之新興非揮發性記憶體測試技術(2/3)

引用此