Minimizing residual stress of aluminum nitride (AlN) thin films using multi-step deposition of DC pulsed sputtering

Wei Lun Chen, Shang Shian Yang, Ning Hsiu Yuan, Wei Yu Zhou, Yu Pu Yang, Hsiao Han Lo, Peter J. Wang, Walter Lai, Yiin Kuen Fuh, Tomi T. Li

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Engineering & Materials Science

Chemical Compounds